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| This is the
integrated COG machine designed to pre-bond
IC chip by align it with LCD glass with
ACF tape attached and to be able to
continue main bonding at a given temperature
and pressure. In pre-bonding operation,
the IC chip on the LCD glass can be
aligned by using the vision system,
ensuring precision operation. Particularly,
even when operation model is changed,
tools and jigs can be easily replaced,
and the zoom feature of the CCD camera
makes it very easy to perform align
mark focusing operation. In addition,
its line monitoring & control function
makes it possible to produce the data
for the optimum operating condition
when applying pressure and heat(optimum
pressure capacity and optimum heating
temperature). Using this data enhance
the uniformity of quality and the data
can be checked and saved remotely. Its
configuration is so designed for line
automation that future on-line connection
can be added without major modification. |
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 Product
Feature |
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- Easy align mark focusing
by means of the vision systems
- Possible to make the data for operating condition
and to check it from a remote place
- Compatible with auto-line
- Easy to change model |
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