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| Manual Bonder |
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 Application |
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| NDP-1100
Is, Manual Bonding Equipment to Heat
Press IC Chip On Substrate. Substrate
Is Loaded By Manual & IC Chip Is
Auto-Loaded By X,Y Mono Carrier And
Bond Substrate & IC chip Which Was
Processed By Image Process Program..
This Equipment Can Correspondable To
COG & COF, OLB application As Option. |
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| Product
Feature |
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- Individual Image Process
By Alignment mark Recognition
- Easy Positioning Using Simultaneous Monitoring
Of 2 Pcs Of Alignment mark
- Using Ceramic heater That verified From Superior
Equipment
(Flip Chip Bonder : Alignment Accuracy ¡¾2§)
- Stable Operating & Control of Pressure Units
Under Low Pressure
- Correspondable To COF, FOG & Main Equipment
- Standard Chip loader
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This is OEM Product of Toray Engineering Co. Ltd., |
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