 |
|
|
|
| |
| - Chip Inspection
& Taping M/C |
| |
|
|
| |
 |
| |
 Product
Feature |
|
- Gauged Value of L、Q
and R Within Index Disk - Classify Good &
NG
- Analyzer：The Newest Hewlett Packard Analyzer
- Adhere to Cover Seal by Using Hot Press wire Bonding
then Roll
Winding
* High Speed Automatic Winder for Measurement, Packing
and Gauge
- T/Time ：300pcs/min
- Gauge ：Rac, LQ or Zθ
|
 |
|
;){kind=small}
