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| This is the integrated COG machine designed to pre-bond IC chip by align it with LCD glass with ACF tape attached and to be able to continue main bonding at a given temperature and pressure. In pre-bonding operation, the IC chip on the LCD glass can be aligned by using the vision system, ensuring precision operation. Particularly, even when operation model is changed, tools and jigs can be easily replaced, and the zoom feature of the CCD camera makes it very easy to perform align mark focusing operation. In addition, its line monitoring & control function makes it possible to produce the data for the optimum operating condition when applying pressure and heat(optimum pressure capacity and optimum heating temperature). Using this data enhance the uniformity of quality and the data can be checked and saved remotely. Its configuration is so designed for line automation that future on-line connection can be added without major modification. |
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 Product
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- Easy align mark focusing by means of the vision systems
- Possible to make the data for operating condition and to check it from a remote place
- Compatible with auto-line
- Easy to change model |
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