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| Manual Bonder |
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| NDP-1100 Is, Manual Bonding Equipment to Heat Press IC Chip On Substrate. Substrate Is Loaded By Manual & IC Chip Is Auto-Loaded By X,Y Mono Carrier And Bond Substrate & IC chip Which Was Processed By Image Process Program.. This Equipment Can Correspondable To COG & COF, OLB application As Option. |
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| Product
Feature |
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- Individual Image Process By Alignment mark Recognition
- Easy Positioning Using Simultaneous Monitoring Of 2 Pcs Of Alignment mark
- Using Ceramic heater That verified From Superior Equipment
(Flip Chip Bonder : Alignment Accuracy ¡¾2§)
- Stable Operating & Control of Pressure Units Under Low Pressure
- Correspondable To COF, FOG & Main Equipment
- Standard Chip loader
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| * This is OEM Product of Toray Engineering Co. Ltd., |
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